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Advanced Aluminum Skived Fin Heatsink with Copper-Embedded Base
Unlocking Thermal Excellence Through Hybrid Innovation
In high-performance electronics, effective thermal management is critical to reliability and longevity. Our Aluminum Skived Fin Heatsink with Copper-Embedded Base redefines heat dissipation by merging the superior conductivity of copper with the lightweight, cost-efficiency of aluminum. This hybrid design addresses the limitations of traditional single-material solutions, offering a balance of rapid heat absorption, optimized airflow, and structural durability. Ideal for demanding applications like power electronics, LED systems, and automotive components, this heatsink sets a new benchmark for thermal performance.
Base Material | Thermal Conductivity | Fin Height | Thickness of Fin | Gap of Fin | Length of Heatsink |
---|---|---|---|---|---|
1060 Al and Copper | 210–255 W/m·K (hybrid base) | 10–120mm (customizable) | 0.15 ~ 2mm | 0.2 ~ 6mm | ‹ 2000mm |
Core Technology: Dual-Material Synergy
- Copper-Embedded Base for Rapid Heat Transfer - The heart of this heatsink lies in its copper insert, strategically embedded into the aluminum base. Copper’s exceptional thermal conductivity (385 W/m·K) enables rapid heat absorption from high-power components, reducing localized hotspots. Unlike pure aluminum designs, which struggle with heat accumulation, the copper core acts as a thermal highway, directing heat toward the skived fins for efficient dissipation.
- Skived Aluminum Fins for Enhanced Convection - Precision-skimmed aluminum fins, as thin as 0.3mm, maximize surface area while maintaining structural integrity. The skiving process creates uniform, tightly spaced fins that optimize airflow contact, accelerating natural or forced convection cooling. This design outperforms stamped or bonded fins by eliminating gaps and minimizing thermal resistance.
- Seamless Material Integration - Advanced bonding techniques ensure a defect-free interface between copper and aluminum, eliminating thermal barriers. This hybrid base achieves a composite thermal conductivity of 220–250 W/m·K, bridging the gap between pure copper performance and aluminum’s cost efficiency.
What are the main advantages of the copper embedded aluminum heat sinks?
- Superior Heat Dissipation - 20–30% Thermal Improvement: The copper-aluminum hybrid base reduces thermal resistance by 40% compared to standard aluminum heatsinks, enabling faster heat transfer and lower operating temperatures.
- High-Density Fin Design - Skiving technology allows ultra-thin fins (down to 0.05mm thickness) and minimal spacing, increasing heat exchange area by up to 50% within compact footprints.
- Lightweight & Cost-Effective - Aluminum constitutes over 80% of the heatsink’s structure, reducing weight by 30% compared to full-copper solutions. This hybrid approach slashes material costs while maintaining near-copper-level performance.
- Adjustable Copper Thickness - Tailor the copper insert’s depth (1–5mm) to match specific thermal loads.
- Flexible Fin Configurations - Choose from single/double-sided skiving, staggered fin layouts, or integrated heat pipe compatibility for extreme thermal scenarios.
- Robust Durability - Anodized aluminum surfaces and corrosion-resistant coatings ensure longevity in harsh environments. The monolithic skived structure prevents fin loosening, a common failure point in welded or glued designs.
Competitive Edge Over Alternatives
- Versus Pure Copper Heatsinks - While copper offers unmatched conductivity, its weight and cost make it impractical for large-scale applications. Our hybrid design achieves 85–90% of copper’s performance at half the weight and 60% lower cost.
- Versus Traditional Aluminum Heatsinks - Standard extruded aluminum fins suffer from limited fin density (≥1mm thickness) and slower heat absorption. Skived fins with copper cores boost heat dissipation efficiency by 25–35%.
- Versus Bonded/Welded Designs - Unlike bonded fins, which introduce interfacial thermal resistance, skived fins are monolithic, ensuring 100% material conductivity and eliminating delamination risks.
There are many applications across industries that the copper embedded heatsinks are used.
- Electronics - CPUs, GPUs, and power modules in servers and telecom infrastructure.
- Automotive - EV battery cooling, onboard chargers, and motor controllers.
- Renewable Energy - Inverters for solar/wind systems and energy storage units.
- LED Systems - High-brightness lighting arrays requiring stable thermal management.
Contact our engineering team to explore how our hybrid heatsink can solve your thermal challenges. From prototyping to mass production, we deliver solutions that balance performance, cost, and reliability.
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